PCB Prototype
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| FR4 PCB | 1 layer | 5 Days | 72 hours |
| 2 layers | 6 Days | 4 Days | |
| 4 layers | 7 Days | 5 Days | |
| 6 layers | 7 Days | 5 Days | |
| 8 layers | 8 Days | 6 Days | |
| 10 layers | 10 Days | 8 Days |
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| HDI PCB | 1+ | 12-15 Days | 1 Week |
| 2+ | 12-15 Days | 10 Days | |
| 3+ | 15-20 Days | 12 Days | |
| 4+ | 20-25 Days | 18 Days | |
| Any layer | 1 month | 20 Days |
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| Ceramic PCB | 1 layers | Thick Film:3 - 3.5weeks DCB/DBC/AMB: 3 - 4 weeks DPC: 2 - 3 weeks | Thick Film:1.5weeks DCB/DBC/AMB: 2 - 3 weeks DPC: 1.5 weeks |
| 2 layers | Thick Film:3 - 4 weeks DCB/DBC/AMB:3.5-4.5weeks DPC: 2.5 - 3.5 weeks | Thick Film:2 weeks DCB/DBC/AMB:2.5 - 3.5weeks DPC: 2 weeks | |
| 4 layers | Thick Film: 4 - 6 weeks | 2.5 weeks | |
| 6 layers | Thick Film: 4.5 - 6 weeks | 2.5 weeks | |
| 8 layers | Thick Film: 5 -7 weeks | 3 weeks | |
| 10 layers | Thick Film: 6 - 8 weeks | 3.5 - 4 weeks |
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| Metal core PCB | 1 layers | 1 Week | 4 Days |
| 2 layers | 1.5 Weeks | 7 Days | |
| 4 layers | 2.5 Weeks | 10 Days | |
| 6 layers | 3 Weeks | 12 Days | |
| 8 layer | 1 month | 15 Days |
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| Flexible PCB | 1 layers | 3-7 Days | 48 Hours |
| 2 layers | 3-7 Days | 48 Hours | |
| 3 layers | 8-12 Days | 1 Week | |
| 6 layers | 12-16 Days | 10 Days | |
| 8 layer | 18-25 Days | 15 Days |
| Prototype(<3m²) | Layer counts | Normal delivery | Urgent orders |
| Rigid-flex PCB | 2 layers | 8-14 Days | 1 Week |
| 3 layers | 14-16 Days | 8 Days | |
| 4 layers | 15-20 Days | 10 Days | |
| 6 layers | 20-25 Days | 12 Days | |
| 8 layer | 1 months | 15 Days |
PCB Prototype
BETON PCB Manufacturer will not only provide you with significant cost savings on prototype PCBs, but it will also insure to meet all your desirable turn-around times. More often than not, turn-around times would be achieved even faster than local manufacturers.
- The timely lead time
- The largest prototype PCB manufacturers in China
- Specialize in producing small volume PCBs
- More than 40000 square meters/month
All quick turn PCB prototype shipments are done using DHL/FedEx/UPS express shipment services to achieve the fastest and most reliable delivery.
Free check before production
Our engineer will make the EQ (DRC inspection, DFM inspection, ICT design, silk screen adjustment, Drill layer labeling)and working Gerber for your confirmation to avoid the mass loss. And save time in PCB Prototype.
Lower cost
When the cost is over high, our engineer manufacturing term will give you the advice to make the cost low. And give the best design and good quality PCB prototype.
Quality Control
Our PCB prototypes are manufactured according to the industry's ISO-9001 and IPC quality standards. We can also use this standard on mass production.
PCB Reverse Engineering Service
We can provide the PCB Reverse Engineering
Service. From the PCB sample to PCB design file. Shorten the product design and
development cycle, and speed up product replacement.
Quick PCB Board Fabrication Capabilities
| Item | Fabrication Capabilities |
| The number of layers | 1-48 layers |
| Material | FR-4,Aluminum,Flexible,High Frequency Material |
| Maximum PCB Size | 500*1100mm (min 5*6mm) |
| Board Size Tolerance | ±0.2mm/±0.5mm |
| Board Thickness | 0.2-2.4mm |
| Board Thickness Tolerance | (t≥1.0mm):±10%, (t<1.0mm):±0.1mm |
| Min Trace | 0.1mm/4mil |
| Min Spacing | Normal:0.1mm/4mil Save cost:0.15mm/6mil |
| Outer Layer Copper Thickness | 1-30oz(35-1050μm) |
| Inner Layer Copper Thickness | 0.5oz-30oz(18-1050μm) |
| Drill Sizes (CNC) | 0.2-6.3mm |
| Min Width of Annular Ring | 0.15mm(6mil) |
| Finished Hole Diameter (CNC) | 0.2-6.3mm |
| Finished Hole Size Tolerance(CNC) | ±0.08mm |
| Solder Mask | LPI(Liquid Photo-Imageable) |
| Minimum Character Width/Height(Legend) | 0.15mm/0.8mm |
| Character Width to Height Ratio (Legend) | 1:5 |
| Minimum Diameter of Plated Half Holes | 0.6mm |
| Surface Finishing | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, ImAg, ImSn |
| Solder Mask color | Green ,Red, Yellow, Blue, White ,Black, Matte black, Violet and any color you need |
| Silkscreen color | White, Black, no silkscreen |
| Panelization | V-scoring, Tab-routing( with Stamp Holes) |
| Test and Certificate | Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 ,UL Certificate |
| Item | Fabrication Capabilities |
| The number of layers | 1+,2+,3+,4+, any layer |
| Material | FR-4, High TG FR-4 , Halogen Free material, KB, ITEQ,ShengYI,PTFE,Rogers ,Arlon ,Taconic,Teflon,etc. |
| Maximum PCB Size | 650*1500mm |
| Board Size Tolerance | ±0.2mm/±0.5mm |
| Board Thickness | 0.1-3.2mm |
| Gold Finger Thickness | Normal:0.025-1.27μm Best:1.27-1.51μm |
| Resin Fill | min./max hole size:0.2/1.0mm |
| Max Hole Desity | ±0.075mm |
| Outer Layer Copper Thickness | 1-10oz(35-350μm) |
| Inner Layer Copper Thickness | 0.5oz-10oz(18-350μm) |
| Hole Wall Cu thickness | min.20/ave. 25μm |
| Min Width of Annular Ring | 0.15mm(6mil) |
| Buried Min. Via size | 0.2mm |
| Backdrill Min. Via size | 0.4mm |
| Aperture Tolerance | PTH±3mil,NPTH±2mil |
| Minimum Character Width/Height(Legend) | 0.15mm/0.8mm |
| Mechnical Drill Aspect Ratio | 20:1 |
| Impedance Control tolerance | Normal:±10% Best:±5% |
| Surface Finishing | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, ImAg, ImSn |
| Solder Mask color | Green ,Red, Yellow, Blue, White ,Black, Matte black, Violet and any color you need |
| Silkscreen color | White, Black, no silkscreen |
| Panelization | V-scoring, Tab-routing( with Stamp Holes) |
| Test and Certificate | Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 ,UL Certificate |
| Item | Thick Film Technology | AMB Technology | DPC Technology | DCB/DBC Technology |
| The number of layers | 10 layers | 2 layers | 2 layers | 2 layers |
| Material | AI203, ALN, BeO, ZrO2 | ALN, Si3N4 | AI203, ALN, ZrO2, Si3N4 | AI203, ALN, ZrO2 |
| Maximum PCB Size | 200*200mm | 114*114mm | 138*190mm | 138*178mm |
| Min Board Thickness | 0.25mm | 0.25mm | 0.25mm | 0.30mm~0.40mm |
| Max Board Thickness | 2.0mm | 1.8mm | 2.0mm | 1L: 1.3mm; 2L 1.6mm |
| Conductor Thickness | 5um - 13um | 8oz- 22.9oz | 2um - 200um | 3.9oz - 8.6oz |
| Min Line Width | 6/0.15mm | 20mil/0.50mm | 6/0.15mm | 12mil/0.30mm |
| Min Line Space | 8mil /0.20mm | 20mil/0.50mm | 8mil /0.20mm | 12mil/0.30mm |
| Line Width Tolerance | ±5mil (0.125mm) | ±5mil (0.125mm) | ±1mil (0.025mm) | ±5mil (0.125mm) |
| Line Space Tolerance | ±5mil (0.125mm) | ±5mil (0.125mm) | ±1mil (0.025mm) | ±5mil (0.125mm) |
| Min PAD Ring | 6mil (0.15mm) | NA | 3mil (0.075mm) | NA |
| Min BGA PAD Margin | 12mil (0.30mm) | 8mil (0.20mm) | 5mil (0.125mm) | 8mil (0.20mm) |
| Min Soldermask Bridge | 12mil (0.30mm) | 8mil (0.20mm) | 6mil (0.15mm) | 8mil (0.20mm) |
| PTH Dia Tolerance | ±4mil (0.1mm) | |||
| NPTH Dia Tolerance | ±2mil (0.05mm) | |||
| Hole Position Deviation | ±4mil (0.1mm) | |||
| Surface Finishing | AgPd, AuPd, Mn/Ni | OSP/Ni Plating, ENIG | OSP/ENIG/ENEPIG | OSP/Ni Plating, ENIG |
| Outline Tolerance | Laser: +0.2/0.05mm; Die Punch: +0.25/0.20mm | Laser: +0.2/0.05mm | Laser: +0.2/0.05mm; Die Punch: +0.25/0.20mm | Laser: +0.2/0.05mm |
| Thermal Stress | 1 hour @ 350℃ | 3 x 10 Sec @ 280℃ | 15 min @ 350℃ | 3 x 10 Sec @ 280℃ |
| Item | Fabrication Capabilities |
| The number of layers | 1-10 layers |
| Material | Aluminum core, Copper core |
| Thermal Conductivity (ω/m-k) | 1.0w-2.0w |
| Board Size Tolerance | ±0.1mm |
| Board Thickness | 0.8-4mm |
| Max board size | 585*1000mm |
| Min Trace | 0.1mm |
| Min Spacing | 0.1mm |
| Min Hole SIZE | 0.15mm |
| Min BGA PAD | 14miL |
| Drill Sizes (CNC) | 0.2-6.3mm |
| PTH Hole Dia Tolerance | ±0.05mm |
| Non-PTH Hole Dia Tolerance | ±0.05mm |
| Solder mask file Min thickness | 10mil |
| Hole Position Deviation | ±0.076mm |
| Minimum Character Width/Height(Legend) | 0.15mm/0.8mm |
| Character Width to Height Ratio (Legend) | 1:5 |
| Minimum Diameter of Plated Half Holes | 0.6mm |
| Surface Finishing | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, ImAg, ImSn |
| Solder Mask color | Green ,Red, Yellow, Blue, White ,Black, Matte black, Violet and any color you need |
| Silkscreen color | White, Black, no silkscreen |
| Other Options | Countersinks, Castellated Holes, Custom Stackup |
| Quality Grade | Standard IPC 2,ISO9001, UL, RoHS, REACH |
| Item | Fabrication Capabilities |
| The number of layers | 1-30 layers |
| Material | PI, PET, EMI,FR4 |
| Maximum PCB Size | 250*410mm (min8*12mm) |
| Board Thickness | 0.027-1mm |
| Board Thickness Tolerance | ±0.02mm |
| PI Stiffener Material specification | 1-13 mil |
| PET Stiffener Material specification | White:0.05-0.25mm Transparent0.025-0.25mm |
| Fr4 Stiffener Material specification | ≥50um |
| Punching hole tolerance | ±0.025mm |
| Stiffener thickness | 0.01mm |
| PTH Hole Dia Tolerance | ±0.05mm |
| Non-PTH Hole Dia Tolerance | ±0.025mm |
| Min. Line Width /Space | ±0.05mm |
| Outer Tolerance | ±0.1mm |
| Minimum Character Width/Height(Legend) | 0.15mm |
| Min BGA PAD | 0.25mm |
| Min Width of Annular Ring | Single side 0.1mm |
| Plating layer thickness | Nickel: 1-6um, Gold: 0.03-2um |
| Impedance Control tolerance | Normal:±10% Best:±5% |
| Acceptance standard | IPC-6013, IPC-600 |
| Surface Finishing | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, ImAg, ImSn |
| Coverlay film color | Yellow, Green, White, EMI, Matt Black, Gloss Black |
| Silkscreen color | White, Black, no silkscreen |
| Max Aspect Ratio | 8:1 |
| Test and Certificate | Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 ,UL Certificate |
| Item | Fabrication Capabilities |
| The number of layers | 2-48 layers |
| FPC main substrate | Taiflex,Gracethw,Shengyi,Songrun |
| PCB material | Shengyi,ITEQ,KB,FR4 |
| Board Thickness | 0.25-6mm |
| Min Width/Spacing | 0.05mm/0.05mm |
| Maximum Rigid-flex PCB Size | 230*500mm |
| Minimum Rigid-flex PCB Size | 5*8mm |
| Insulation Thickness | 12.5um,25um,50um |
| Copper foil thickness | 12um,18um,36um,70um |
| Stiffener material | FP4,PI, PET, SUS,PSA |
| Min drilling diameter | Mechanical drilling: 0.15mm, laser drilling: 0.1mm |
| Via Tolerance | NPTH:±0.05mm PTH:±0.075mm |
| PI Thickness | 0.5mil,0.7mil,0.8mil,1mil,2mil |
| Min weld ring | Inner:5mil Outer:4mil |
| Min stiffener size | 4*5mm |
| Max stiffener size | 32*32mm |
| Stiffener Alignment accuracy | ±0.075mm |
| Character to Pad | 0.15mm |
| Etching Tolerance | ±20% |
| Surface Finishing | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, ImAg, ImSn |
| Solder Mask color | Green ,Red, Yellow, Blue, White ,Black, Matte black, Violet and any color you need |
| Silkscreen color | White, Black, no silkscreen |
| Test and Certificate | Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 ,UL Certificate |