Solder Paste Inspection (SPI)

Improper solder paste printing results in low product reliability and reduced performance.

Check function:

Reduces defects caused by improper solder paste printing, allowing immediate rework for high-quality solder paste printing. More time will be saved and manufacturing efficiency will be improved, early defects will be avoided to be delayed to the later stage of manufacturing, and costs will be reduced.

Automated Optical Inspection(AOI)

We use AOI instead of manual visual inspection to realize online automatic inspection.

Check function:

Missing parts, deviation, short circuit, reverse, side standing, tombstone, reverse white, multiple parts, poor solder joints (less tin, empty solder, no tin, more tin, thin tin and other poor processes)

X-Ray Inspection

The coverage rate of x-ray inspection technology to process defects is as high as 97%, with layering function.

Check Function:

Defects that can be inspected include: virtual soldering, bridging, standing, insufficient solder, air holes, missing components, etc. In particular, X-ray can also inspect hidden solder joints such as BGA and CSP.

First Article Detector

To ensure the SMT mass production quality, we will carry out the first article inspection, which can effectively and quickly judge the first board, find out the first board errors, omissions, over-posting, and under-posting materials in time, and take corrective or improvement measures to prevent batch failure.

Function Test(FCT)

The simulated operating environment makes the circuit board work in the design state, so as to obtain the output, and perform a test method to verify the functional state of the circuit board. The normal operation of the equipment indicates that the circuit board is qualifie

Testing Reports

If the customers need to COC, we supply the following reports free of charge:

Download: SampleCOCof Beton Technology