|
Item
|
Fabrication Capabilities
|
|
The number of layers
|
1+,2+,3+,4+, any layer
|
|
Material
|
FR-4, High TG FR-4 , Halogen Free
material, KB, ITEQ,ShengYI,PTFE,Rogers ,Arlon ,Taconic,Teflon,etc.
|
|
Maximum PCB Size
|
650*1500mm
|
|
Board Size Tolerance
|
±0.2mm/±0.5mm
|
|
Board Thickness
|
0.1-3.2mm
|
|
Gold Finger Thickness
|
Normal:0.025-1.27μm Best:1.27-1.51μm
|
|
Resin Fill
|
min./max hole size:0.2/1.0mm
|
|
Max Hole Desity
|
±0.075mm
|
|
Outer Layer Copper Thickness
|
1-10oz(35-350μm)
|
|
Inner Layer Copper Thickness
|
0.5oz-10oz(18-350μm)
|
|
Hole Wall Cu thickness
|
min.20/ave. 25μm
|
|
Min Width of Annular Ring
|
0.15mm(6mil)
|
|
Buried Min. Via size
|
0.2mm
|
|
Backdrill Min. Via size
|
0.4mm
|
|
Aperture Tolerance
|
PTH±3mil,NPTH±2mil
|
|
Minimum Character Width/Height(Legend)
|
0.15mm/0.8mm
|
|
Mechnical Drill Aspect Ratio
|
20:1
|
|
Impedance Control tolerance
|
Normal:±10% Best:±5%
|
|
Surface Finishing
|
ENIG, Flash Gold, Hard Gold Finger, Gold
Plating(50mil), Gold finger,Selected Gold Plating, ENEPIG, ENIPIG, HAL,
HASL(LF), OSP, ImAg, ImSn
|
|
Solder Mask color
|
Green ,Red, Yellow, Blue, White ,Black,
Matte black, Violet and any color you need
|
|
Silkscreen color
|
White, Black, no silkscreen
|
|
Panelization
|
V-scoring, Tab-routing( with Stamp Holes)
|
|
Test and Certificate
|
Fly Probe Testing (Free) and A.O.I.
testing(free), ISO 9001:2008 ,UL Certificate
|
