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6 layers PCB is widely used in compact electronics such as wearable devices, communication modules and military equipments. There are high restrict engineering requirements of manufacturing particularly in process of plating, laminating and drilling. Ramming Technology  are very experienced in 6 layers PCB fabrication during past 10 Years . Our internal management of refined SOP processes will highly control quality and production efficiency, due to its complexity.

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The multilayer PCB

As the name suggests, a multi-layer circuit board means that a circuit board with more than two layers can be called a multi-layer, such as four-layer, six-layer, eight-layer and so on. Of course, some designs are three-layer or five-layer circuits, also known as multi-layer PCB circuit boards. Larger than the conductive wiring diagram of the two-layer board, the layers are separated by insulating substrates. After each layer of circuits is printed, each layer of circuits is overlapped by pressing. After that, drilling holes are used to realize the conduction between the lines of each layer. The advantage of multi-layer PCB circuit boards is that the lines can be distributed in multiple layers, so that more precise products can be designed. Or smaller products can be realized by multi-layer boards. Such as: mobile phone circuit boards, micro projectors, voice recorders and other products with relatively large volumes. In addition, multiple layers can increase the flexibility of design, better control of differential impedance and single-ended impedance, and better output of some signal frequencies.

Application advantages of multi-layer PCB circuit boards:

1. High assembly density, small size and light weight, meeting the needs of light and miniaturized electronic equipment;

2. Due to the high assembly density, the connection between components (including components) is reduced, the installation is simple, and the reliability is high;

3. Due to the repeatability and consistency of the graphics, the errors of wiring and assembly are reduced, and the maintenance, debugging and inspection time of the equipment are saved;

4. The number of wiring layers can be increased, thereby increasing the design flexibility;

5. It can form a circuit with a certain impedance, and can form a high-speed transmission circuit;

6. The circuit and magnetic circuit shielding layer can be set, and the metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation.