Technical Specifications (Beton Capability):

1. Advanced Signal Integrity (SI) Solutions

We utilize High-Frequency/Low-Loss laminates and HVLP (Hyper Very Low Profile) copper foil to reduce skin effect losses. Our Back-drilling technology eliminates via stubs, significantly improving the eye diagram for high-speed differential pairs.

2. Superior Thermal Management

AI chips generate intense heat. Beton offers Heavy Copper and Copper Inlay solutions to create low-resistance power paths and high-efficiency thermal conduits, ensuring your hardware stays cool under maximum TDP.

3. Precision Registration & Manufacturing

Using fully automated LDI (Laser Direct Imaging) and vacuum etching, we maintain interlayer registration within ±3mil, ensuring consistent performance across 20+ layers of complex circuitry.

Quality Assurance & Engineering Support

• Free DFM Optimization: Our engineers review your stack-up and signal paths before production to ensure cost-efficiency and manufacturability.

• 100% TDR Verification: Every board is shipped with a comprehensive TDR Impedance Test Report.

• IPC Class 3 Compliance: We manufacture to the highest reliability standards for mission-critical data center applications.

• Fast-Turn Prototypes: Accelerate your R&D cycle with our rapid prototyping service for high-layer count designs.

Application Areas

• AI Training & Inference Servers (GPU/NPU/TPU)

• High-Speed Network Switches (400G/800G)

• High-Performance Computing (HPC) Backplanes

• Automotive Autonomous Driving Systems

Ready to launch your next AI project?

Partner with Beton to transform your high-speed designs into reliable hardware. Send your Gerber files today for a professional DFM review and competitive quote.

Beton Technology Co., Limited Precision Engineering. Unmatched Reliability. Your AI Hardware Partner.