Superior Thermal Reliability

AI GPUs generate localized heat spikes. S1000-2M offers excellent T260/T288 performance and a low Z-axis CTE (Coefficient of Thermal Expansion), ensuring:

• Anti-CAF Performance: Essential for high-density, small-pitch BGA designs (0.8mm and below).

• Thermal Stress Resistance: Maintains structural integrity through multiple lead-free reflow cycles.

High-Speed Signal Integrity

Optimized for the latest SerDes and PCIe standards:

• Stable Dk/Df: Provides consistent dielectric properties across high-frequency ranges.

• Low Loss: Ideal for the long-trace routing required in AI server motherboards.

Advanced Manufacturing Capabilities at Beton Tech

Precision Back-Drilling

To support PCIe 5.0/6.0 and 800G networking, we utilize controlled-depth back-drilling to remove PTH Stubs. This eliminates signal reflections and ensures impedance continuity across ultra-high-layer counts (up to 64 layers).

High-Order HDI & LDI Technology

• Laser Microvias: Precise drilling down to 0.075mm with void-free copper filling.

• LDI Registration: Using Laser Direct Imaging to ensure layer-to-layer alignment within ±5 mils—critical for 20+ layer stacks.

Heavy Copper for Power Delivery

For AI power modules, we support heavy copper layers to manage the high-current demands of modern GPU clusters.

 Typical Applications

• AI Training Clusters: GPU Baseboards (OAM/UBB) and Switch Boards.

• High-Performance Computing (HPC): Supercomputing nodes and liquid-cooled systems.

• Networking: 400G/800G optical modules and high-speed routers.

• Storage: High-density NVMe-oF controller cards.

Quality Control & Lead Times

• Testing: 100% AOI, Flying Probe/E-test, TDR Impedance Check, and Micro-section analysis.

• Prototype Delivery: 10 - 15 Days for high-layer/HDI boards (2x faster than industry average).

• Certification: ISO9001, UL, IATF16949.