30 Layer Wafer test board
2025-03-15
Material:TU-768
Finished thickness:6.0MM
Min Trace/Space:5Mil/4Mil
Min Space Between Via&Line:7Mil
Aspext Ratia:17:1
Key Processes:Laser Drilling, Resin Plugging, Sequential Lamination
Core Technology Innovation Highlights for 30 Layer Wafer test board
✅ Breakthrough 17:1 deep hole aspect ratio technology
✅ 5/4mil ultra-precision line etching tolerance ±0.1mil
✅ TU-768 high-frequency material certification (IPC-4103 standard)
✅ Military-grade thermal stability (-55℃~+260℃)
Applications of the 30 Layer Wafer Test Board: Semiconductor, Automotive, AI, and Power Device Testing
Applications | ||
Industry | Use Case | Keyword Integration |
Semiconductor testing | Wafer probe card, IC aging test board | "Wafer Probe Card PCB"
|
Automotive chip verification
| Automotive-grade MCU/SoC test interface board | "Automotive IC Test Board"
|
AI chip Research and Development | GPU/TPU wafer-level performance verification | "High-Density AI Test PCB" |
Power device testing | IGBT/SiC module aging test | "High-Current Wafer Test Board" |
Manufacturing Capability Certification of our 30 Layer Wafer test board
1. IPC-A-600G Class 3 Acceptance Standard
2. ISO 9001:2015 Quality System Certification
3. 100% Flying Probe Test + AOI Automatic Optical Inspection
Key Features & Benefits of the 30 Layer Wafer Test Board: Enhanced Performance & Precision
✅ Ultra-High Density Design
5mil/4mil Trace/Space: Supports complex signal routing for multi-channel wafer testing systems.
17:1 Aspect Ratio Vias: Laser-drilled microvias with 25μm+ copper plating, enabling high-current and high-frequency signal integrity.
✅ TU-768 Material Excellence
Low Dk (4.3 @10GHz) & Low Loss (Df=0.02): Minimizes signal distortion in high-speed wafer probing applications.
High Tg (180°C) & Thermal Conductivity (0.69 W/m·K): Withstands thermal stress during burn-in testing and high-power validation.
✅ Semiconductor-Grade Reliability
6.0mm Thickness ±5%: Structural stability for large-size wafer contactor boards.
7mil Via-to-Line Spacing: Prevents crosstalk in dense probe card layouts.
✅ Certified Performance
IPC-6012 Class 3A: Passes 1000x thermal cycling (-55°C~+200°C) and 85/85 humidity tests.
FAQ: Lead Time, Thermal Stress Management, and Probe Contact Support for 30-Layer Wafer Test Boards
Q: What is the minimum order quantity (MOQ)?
A: Standard test board supports ordering from 1pc, mass production orders start from 10㎡
Q: Is impedance simulation service supported?
A: Provides HyperLynx full process signal integrity analysis
Q: What is the lead time for 30-Layer Wafer Test Boards?
A: Prototype: 25 days, Mass production: 6 weeks with exposed options.
Q: How to manage thermal stress in thick PCBs?
A: Our TU-768 + Symmetrical Stack-up Design reduces CTE mismatch.
Q: Can you support 0.3mm pitch probe contacts?
A: Yes! 5/4mil trace/space enables 0.3mm pitch BGA routing.
Core comparison analysis of Probe Card, Test Load Board and BIB
Probe Card: Probe Card is used to test uncut and unpackaged semiconductor devices. By electrically testing each chip on the wafer, devices with parameters within the required range are selected for packaging.
Load Board: A load board is required on Final Test testing equipment. The load board is used to perform functional or performance testing of the device after the device is packaged to screen out the packaged poor devices. For ICs with high-speed interfaces, the corresponding load board usually has strict impedance requirements.
Aging test board (BIB) is used for aging tests of the chip after packaging, such as thermal cycles or accelerated switch cycles, to expose early failures of the device. The PCB material of aging boards must be able to withstand long-term and repeated exposure to high temperature environments, and has extremely high reliability.
Feature | Probe Card | Test Load Board | BIB (Burn-In Board) |
Primary Use | Wafer-level testing | Functional testing of packaged ICs | Burn-in and stress testing |
Typical Application | Semiconductor testing (wafer probing) | Post-assembly testing | High-reliability IC testing |
Thermal Management | Limited (requires external cooling) | Minimal (based on DUT design) | Enhanced (for high-temperature stress) |
Electrical Interface | High-density interconnects for fine-pitch ICs | Power, ground, and test signals for DUT | Power, ground, and high-voltage signals for burn-in |
Target Devices | Wafer-level ICs | Packaged ICs, DUTs | Power devices, automotive ICs |
The 30 Layer Wafer test board is Probe Card. So if you have any Wafer test board need production, please contact us freely. And we can help to manufacture your board.