14-Layer High-Reliability HDI PCB (ENEPIG & IPC Class 3)
2026-01-17
Layer Count:14 Layers
Material:Rogers4350B+Shengyi
Standard :IPC Class 3
Solder Mask:Green
Silkscreen :White
Surface Finish:ENEPIG
Via Structure: Blind Vias (L1-L2, L13-L14) & Through Vias (L1-L14)
Via Process:Filled & Capped - Non-conductive
Min. Copper in PTH:≥ 0.025 mm (Average)
Material:Rogers4350B+Shengyi
Standard :IPC Class 3
Solder Mask:Green
Silkscreen :White
Surface Finish:ENEPIG
Via Structure: Blind Vias (L1-L2, L13-L14) & Through Vias (L1-L14)
Via Process:Filled & Capped - Non-conductive
Min. Copper in PTH:≥ 0.025 mm (Average)
Manufacturing Capabilities & Highlights
Advanced Via-In-Pad Technology
We specialize in IPC-4761 Type VII (Filled and Capped) vias. This process involves filling via holes with premium non-conductive material and applying a metallized coating over them, ensuring a completely flat surface for components and superior reliability for high-density interconnects (HDI).
Complex Blind Via Lamination
Our facility is equipped to handle complex drill pairs as defined in your .GD1, .GD2, and .GD3 files, ensuring precise alignment and electrical connectivity for:
We provide selective Edge Plating according to mechanical layer requirements. Our process ensures robust plating in designated areas while maintaining strict clearance in center conductors and gap areas to prevent signal interference.
Quality Assurance for Mission-Critical Apps
We provide a full traceability package with every order:
If you require high-layer count boards with ENEPIG finish and IPC Class 3 certification, our engineering team is ready to review your Gerber files.
[Contact Our Engineering Team] | [Request a Quote]
Advanced Via-In-Pad Technology
We specialize in IPC-4761 Type VII (Filled and Capped) vias. This process involves filling via holes with premium non-conductive material and applying a metallized coating over them, ensuring a completely flat surface for components and superior reliability for high-density interconnects (HDI).
Complex Blind Via Lamination
Our facility is equipped to handle complex drill pairs as defined in your .GD1, .GD2, and .GD3 files, ensuring precise alignment and electrical connectivity for:
- L1-L2 Blind Vias
- L13-L14 Blind Vias
- L1-L14 Through Vias
We provide selective Edge Plating according to mechanical layer requirements. Our process ensures robust plating in designated areas while maintaining strict clearance in center conductors and gap areas to prevent signal interference.
Quality Assurance for Mission-Critical Apps
- IPC Class 3 Compatibility Report: Every shipment includes a comprehensive report verifying compliance with Class 3 standards (highest reliability, no-fail performance).
- Zero Repair Policy: In strict accordance with IPC Class 3 for mission-critical electronics, no board repairs are permitted. Any board failing to meet the standard is rejected.
- 100% Netlist Testing: Continuity and short tests are applied IAW IPC-9252 using your generated Gerber netlists.
- Material Integrity: We use only IPC-4101B compliant laminates. For Bond Enhancement and Foil Profile, we provide expert consultation to select the optimal parameters for your specific stack-up.
- Solderability: Guaranteed IAW J-STD-003, Class 3, Category 2.
We provide a full traceability package with every order:
- Certificate of Compliance (CoC)
- Cross-section Analysis (on request)
- Solderability Test Reports
- Full IPC Class 3 Inspection Report
If you require high-layer count boards with ENEPIG finish and IPC Class 3 certification, our engineering team is ready to review your Gerber files.
[Contact Our Engineering Team] | [Request a Quote]