Custom 6-Layer ELIC Any-Layer HDI Flexible PCB For Smart Rings
2026-04-18
Technical Specifications
Key Parameters | Details |
Layer Count | 6-Layer Multilayer FPC |
Interconnect Technology | Any-Layer HDI (ELIC) |
Finished Thickness | 0.39mm ± 0.1mm |
Min. Hole Size | 0.075mm (Laser Microvia) |
Surface Finish | ENIG (Au ≥ 0.05μm, Ni: 2-10μm) |
Stack-up Structure | 1+1+2+1+1 Symmetrical Design |
Special Processing | R0.2-R0.5mm Fillet Outlines (R-Angles) |
Why Choose ELIC Any-Layer Technology for Smart Rings?
Maximum Space Utilization: Traditional through-holes consume valuable real estate across all layers. Our Any-Layer HDI technology uses stacked laser microvias, freeing up over 40% of the internal space for component placement.
Superior Reliability: Using adhesiveless base materials ensures the FPC can withstand the tight-radius bending required during the ring’s assembly process without delamination.
Optimized for SMT: Controlled via dimples (≤18μm) enable Via-in-Pad technology, ensuring stable soldering for 0201 or even 01005 components.
Figure 1: The 1+1+2+1+1 Any-Layer stack-up allows for seamless interconnectivity between any two layers, optimized for miniaturized wearable hardware.
Proven Technical Expertise
We don't just manufacture; we solve engineering challenges. We recently helped a client overcome routing bottlenecks for a high-performance health-tracking ring.
👉 Check out the full technical breakdown here:
DFM Support: We review your stack-up and drill files to ensure mass-production viability.
Quick Prototyping: Specialized laser-cutting equipment for fast-turn sample delivery.
Strict Quality Control: Every board undergoes automated optical inspection (AOI) and comprehensive electrical testing.