Beton's laser direct writing leads internationally in ceramic-based planar/3D thick film circuits.

2025-08-09 With the rapid development of domestic 5G, national defense, aerospace, satellite communications and other fields, ceramic-based thick film or thin film circuits are usually used to replace conventional circuits in power interconnection and radio frequency electronics in the related wireless communication fields to ensure their reliability and durability.

To meet this development need, Beton has developed internationally leading laser direct writing technology and related equipment for planar or three-dimensional thick-film circuits on ceramic substrates. These technologies are particularly well-suited for processing new, specialized materials and complex processes. Equipped with a picosecond laser and an optional three-dimensional direct writing system, the equipment can easily achieve the fine writing of circuit patterns on planar or three-dimensional surfaces and the precision cutting of substrate materials, making it the perfect tool for processing thick-film or thin-film circuits on ceramic substrates. Due to the characteristics of picosecond laser pulses, virtually no heat is generated during processing, and the processed material shows little signs of thermal damage or ablation. Therefore, this laser equipment can achieve high-precision cutting and etching of any desired material using a flexible and precise "cold processing" method.

Sharp corners and smooth edges create circuit patterns. 

The etched surface maintains a consistent depth and is flat. 

Three-dimensional circuit patterns are created in one step.

The Beton intelligent laser direct writing system operates without any contact with the material, requiring no chemical additives, and eliminating the need for unnecessary consumables. With the 3D direct writing system configured, even complex 3D circuit patterns can be easily created. The system's parameters, such as laser power and pulse energy, are adjusted for different materials and applications.

Of course, this is just one of the many applications for Beton's intelligent laser equipment. The system not only easily processes specialized materials but is also suitable for laser drilling and blind grooving of LTCC/HTCC, laser drilling and blind grooving of ceramic-based materials, etching of thin metal circuits on glass, cutting of PTFE high-frequency substrates, laser windowing of cover films, contour cutting of flexible circuit boards, and laser decapping of rigid-flex boards.
Sharp corners and smooth edges are achieved. Etched surfaces are uniformly deep and flat. Three-dimensional circuit patterns are created in one step.

The Beton direct writing system operates without contact with the material, requiring no chemical additives, and eliminating the need for unnecessary consumables. With the 3D direct writing system configured, even complex 3D circuit patterns can be easily created. The system's parameters, such as laser power and pulse energy, are adjusted for different materials and applications.

Of course, this is just one of the many applications for Beton laser equipment. The system not only easily processes specialized materials but is also suitable for laser drilling and blind grooving of LTCC/HTCC, laser drilling and blind grooving of ceramic-based materials, etching of thin metal circuits on glass, cutting of PTFE high-frequency substrates, laser windowing of cover films, contour cutting of flexible circuit boards, and laser decapping of rigid-flex boards.